Totally meet various
requirements for lead free
processing
Windows XP operations system
and the Chinese /English interface
can be switched online freely
PCL+Modular control design to
achieve the high reliable and
repetitive accuracy
Dual temperature sensor and
dual safety control model to ensure
the system shall cut off when the
abnormal occurred
Adopts the design of
independent temperature and the
adjustable wind speed to meet a
variety of precision from the lead-
free soldering process requirements
The new oven design can
effectively reduce the temperature
difference between the different size
of the electronics element to ensure
the reliability of solder joints and
eliminate the hidden trouble of
thermal damage to components. The forced cooling system is
easily to realize the cooling speed
requirements of all kinds of lead-free
solder paste (≧3oc/s) Fault self-diagnosis functions to
display the trouble and store it in
alarming list.
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