Trade Lead Description:
50nm
Detailed Product Description
It possesses high purity, small and uniform particle diameters, large specific surface area, high surface activity, low loose loading density and good injection formation property, high modulus, high dielectric, refractory, anti thermal shock, lower thermal expansion compatible with Silicon, excellent thermal conductivity. It provides lower sintering temperature and higher strength & ductility from the compaction. It can be used in lubricants and so on. Some applications: It can be utilized for the integrate circuit substrate, electronic devices, optical devices, thermal conductive devices such as ceramics, crucibles used ati high temperatures, composites with metal matrixes and polymer matrixes, especially, in the high temperature seal binders and electronic encapsulation materials. it also can be used in fiber playing the role of thermal conductivity and avoiding stoping up spinneret. Posted from China - Anhui on 17 August, 2008 Last Modified on 29 August, 2008
|
|
|